Master in Microelectronics Technology and Manufacturing Management
Module 1.4 - Back End Operation
1.4.1 - Package road map, die attach & Wire Bonding
Program focus
This 18h course is intended to give a basic overview of semiconductor
assembly operations from the wafer Backgrinding up to Wire Bonding. It
also includes a Package roadmap.
Benefits
The objective is to allow attendees to understand the main issues related
to semiconductor operations from the wafer reception from Front End (Grinding,
Mounting, Sawing, Die Attach, Wire Bonding) with the relative impact on
final product quality. The assembly operations are preceded by Package
Family Description and Roadmap, for packages based on metal Lead Frame
(Signal and Power Packages) and laminate (BGA and Optical Packages).
1.4.2 - Adhesion and Moulding
Program focus
This 6h course is intended to give a basic overview of semiconductor assembly
operation of Mould and Adhesion Theory.
Benefits
The objective is to allow attendees to understand the main issues related
to semiconductor operation of Moulding with the relative impact on final
product quality. A huge section is dedicated to Adhesion mechanism theory.
1.4.3 - Post Mould Operations
Program focus
This 6h course is intended to give a basic overview of semiconductor assembly
operations after Mould and Lead Frame design Process.
Benefits
The objective is to allow attendees to understand the main issues related
to semiconductor operations after Mould (Dambar Cutting, Marking, Trim
&Form) with the relative impact on final product quality. They will
also follow all the steps of Lead Frame Design as summary of all assembly
operations, focusing on technologies, capabilities and manufacturing.
1.4.4 - Back End Automation
Program focus
This 12h course is intended to give a basic overview of semiconductor
assembly Automation in ST.
Benefits
The objective is to allow attendees to understand the main issues related
to Automation levels used in ST for its Assembly, Testing and Finishing
production lines.