Master in Microelectronics Technology and Manufacturing Management
Module 4.2 - Technical Improvements
Detail
4.2.2 - micropackaging technologies flows
4.2.3 - Fundamentals of Electrical Package Design
4.2.4 -Thermo mechanical Approach in Microelectronic assemblies
4.2.5 - WAFER LEVEL CSP – 3D IC presentation
4.2.6 - SELF ASSEMBLY at all scales: from micro to Nano
4.2.7 - Silicon chip packaging in Smart Card products
4.2.8 - PRACTICAL SESSION n°1: SCANNING ELECTRON MICROSCOPY (SEM) and ENERGY DISPERSIVE XRAY (EDX)
4.2.9 - PRACTICAL SESSION N°2: INTROCUCTION TO SCANNING ACOUSTIC MICROSCOPY
4.2.10- PRACTICAL SESSION
N°3: PIEZZORESISTIVE-BASED SENSORS FOR LOCAL MECHANICAL STRESS
4.2.1 - Micro packaging
Program focus
This 30 hours course deals with fundamentals of micro packaging.
Benefits
At the end of the week, the students will have an overview of the “multi-physics”
approach of the micro packaging.
4.2.2 - micropackaging technologies flows
Focus: The course targets the challenges and solutions that IC packaging techniques are facing in order to accommodate the very demanding Microsystems applications in an environment where the world is going portable and wireless.
Benefits: Standard and Advanced Packaging process flows are described and should complement the first session of the MicroPackaging Tutorial
4.2.4 -Thermo mechanical Approach in Microelectronic assemblies
Focus
Understanding of thermo mechanical final state of several components as
a result of fundamentals laws combined with some fabrication processing
steps
Benefits
Mechanic and temperature management
4.2.5 - WAFER LEVEL CSP – 3D IC presentation
Focus
Have a vision of the WLCSP, 3D IC and System In Package (SIP) and
the reason why such type of package is using for new equipement.
Benefits
Have a general visibility and global information of the advanced
packages.
4.2.6 - SELF ASSEMBLY at all scales: from micro to Nano
Focus:
To give the tools to know i) the physical principles of self-assembly and
ii) the benefits in next generation of micropackaging assembly and future
nanoelectronics.
Benefits:
New opportunities in microelectronics and micropackaging areas.
4.2.7 - Silicon chip packaging in Smart Card products
Focus
This 3-hour course provides a presentation of the smart card products, the
various types of stresses applies during their lifetime and the chosen manufacturing
processes. It describes the failure modes observed on the field and the
technical solutions to improve the reliability. The course ends up with
the future challenges through new products family introduction.
Benefits
At the end of this course, you will better know what a smart card is, how
it is designed according to be stress resistant and what will be trends
for the future.
4.2.8 - PRACTICAL SESSION n°1: SCANNING ELECTRON MICROSCOPY (SEM) and ENERGY DISPERSIVE XRAY (EDX)
Key-Tools for Characterization of Micropackaging Systems
Focus
The objective of this practical session is to highlight the potential of
a scanning Electron Microscopy (SEM) and Energy Dispersive X-ray (EDX) microanalysis
for the characterization of “in package” system.
Benefits
Nomad communicating objects know today a real commercial interest, each
time renewed. These systems (smart card, mobile phone, PDA,...) embed more
and more versatile electronic functionalities (chips, SIM card for phone,
CCD detectors, “touch screen »,...) and their realization
become more and more complex.
Industry must commercialize finest products and control, a fortiori, their
performances and functionalities. That’s why Microelectronics industry
invests and uses precise and reliable characterization equipments.
4.2.9 - PRACTICAL SESSION N°2: INTROCUCTION TO SCANNING ACOUSTIC MICROSCOPY
Focus
Principles of scanning microscope and practice on microelectronic samples
Benefits
Understanding principles of acoustic micro imaging and its applications
in microelectronics field
4.2.10- PRACTICAL SESSION N°3: PIEZZORESISTIVE-BASED SENSORS FOR LOCAL MECHANICAL STRESS
Benefits
The effect of mechanical stress on electronic devices is of particular interest
because stress causes changes in the parametric behaviour of components,
and such stresses are unavoidable by-products of many packaging steps including
die attachment, wire-bonding, and encapsulation. This phenomenon becomes
of increasing importance as the complexity (integration density, number
of metal levels, thermal cycling, packaging effects…) is growing.
Prerequisites
Semiconductors physics and mechanical notions